A novel CMOS integrated Micro-Electro-Mechanical capacitive pressure sensor in SiGe MEMS (Silicon Germanium Micro-Electro-Mechanical System) process is designed and analyzed. Excellent mechanical stress-strain behavior of Polycrystalline Silicon Germanium (Poly-SiGe) is utilized effectively in this MEMS design to characterize the structure of the pressure sensor diaphragm element. The edge clamped elliptic structured diaphragm uses semi-major axis clamp springs to yield high sensitivity, wide dynamic range and good linearity. Integrated on-chip signal conditioning circuit in 0.18 μm TSMC CMOS process (forming the host substrate base for the SiGe MEMS) is also implemented to achieve a high overall gain of 102 dB for the MEMS sensor. A high sensitivity of 0.17 mV/hPa (@1.4 V supply), with a non linearity of around 1 % is achieved for the full scale range of applied pressure load. The diaphragm with a wide dynamic range of 100-1,000 hPa stacked on top of the CMOS circuitry, effectively reduces the combined sensor and conditioning implementation area of the intelligent sensor chip. © 2013 Springer-Verlag Berlin Heidelberg.