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Etch Time Optimization in Bulk Silicon MEMS Devices Using a Novel Compensation Structure
Grace Jency J, Sekar M,
Published in Springer Singapore
2018
Volume: 471
   
Pages: 33 - 40
Abstract
The article aims to analyze the use of different compensation structures in MEMS micromachining technology to determine the minimum release time as fast as possible where undercutting is desirable. A high undercutting rate is advantageous for the formation of suspended structures. Thus, the implication of the present research includes analysis of corner undercutting behavior, their etching time, and etching characteristics using KOH and TMAH etchants. In this paper, the effective time and etchant concentration are studied using 33% KOH at 80, °C and 25% TMAH at 85, °C. It is found that wide bar with slit structure is the best compensation structure with minimum space competence. © Springer Nature Singapore Pte Ltd. 2018.
About the journal
JournalData powered by TypesetLecture Notes in Electrical Engineering Microelectronics, Electromagnetics and Telecommunications
PublisherData powered by TypesetSpringer Singapore
ISSN1876-1100
Open AccessNo