The paper deals with the experimental and numerical investigation of IC chips supplied with different heat flux under laminar forced convection. Seven different configurations (λ) are selected for the study and the substrate board (SMPS board) is oriented for four different angles 0°, 30°, 60°, and 90°. The goal of the current work is to determine the optimum λ, position, and orientation of the substrate board to minimise the temperature of the IC chips. Numerical results are validated with the experimental results and the optimum configuration (λ) is 1.68806. There is a temperature drop of 3–5°C for 30° orientation of the board in comparison with the horizontal orientation of the board. © 2020, © 2020 Informa UK Limited, trading as Taylor &amp; Francis Group.

Tapano Kumar Hotta

School of Mechanical Engineering

Vellore Campus

V K Mathew

Vellore Institute of Technology (VIT) is a private university located in&nbsp;Tamil Nadu, India. Founded in 1984, as Vellore Engineering College, the institution offers 20 undergraduate, 34 postgraduate, four integrated and four research programs. It has campuses in Vellore, Amravati, Bhopal and Chennai.

VIT is one of the top ranked private universities in India according to NIRF, THE and QS Rankings.&nbsp;Govt. of India has recognized&nbsp;VIT, Vellore as an&nbsp;Institution of Eminence. This has allowed VIT to take independent quality initiatives and move up in world ranking.

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Experiment and numerical investigation on optimal distribution of discrete ICs for different orientation of substrate board

International Journal of Ambient Energy

The paper aims at the transient numerical modelling under mixed convection for the cooling of seven protruding asymmetric IC chips mounted on an SMPS board using the phase change material (n-eicosane). The phase change material (PCM) is kept inside the mini-channels fabricated on the board. The objective is to bring down the temperature (minimize the maximum temperature) of the configuration (SMPS board with 7 IC chips) using the n-eicosane inside the mini-channels. It is seen that n-eicosane absorbs the heat dissipated by the IC chips and thus the maximum temperature of the configuration reduces by 5.5%. The effect of channel hydraulic diameter (2.5 mm ≤ Dh ≤ 3.5 mm) on the temperature of the IC chips is also studied. The results suggest that the mini-channel with lower hydraulic diameter gives a better rate of heat transfer from the IC chips and thus cools these effectively. The study is extended using four different phase change materials out of which, n-eicosane has resulted in maximum temperature drop from the IC chips among different PCMs due to its lower melting point value. A correlation is proposed for the non-dimensional temperature (θ) of the IC chips in terms of Fourier number (Fo) to predict the IC chip temperatures during the melting of PCM. © 2019 Elsevier Ltd

Journal of Energy Storage

Role of PCM based mini-channels for the cooling of multiple protruding IC chips on the SMPS board - A numerical study

The study has focused on the role of working fluids (air, water and FC-72) on the cooling of discrete heated modules under free, forced and mixed convection medium. Three non-identical protruding discrete heat sources are arranged at different positions on a substrate board following golden mean ratio (GMR). Numerical simulations for these heat sources are carried out using a commercial software (ANSYS-Icepak R-15) to simulate their flow and temperature fields under three different modes of heat transfer. Results suggest that the temperature of the heat sources is a strong function of their size, position on the substrate board, the velocity of the fluid and type of working fluid used. A correlation has been proposed for the temperature of these heat sources keeping in mind their strong dependence on the afore-mentioned parameters. It has been found that water can be used for better heat removal from the heat sources due to its high boiling point. The whole idea gives a clear insight to the electronic cooling engineers regarding the selection of working fluids and modes of heat transfer for the cooling of electronic components. © 2018, Indian Academy of Sciences.

Fulltext

Sādhanā

Role of working fluids on the cooling of discrete heated modules: a numerical approach

The manuscript deals with the critical review for cooling of discrete heated electronic components using liquid jet impingement. Cooling of electronic components has been a lead area of research in recent years. Due to the rapid growth of electronic industries, there is an enormous rise in the system power consumption, and the reduction in the size of electronic components has led to a rapid increase in the heat dissipation rate per unit volume of components. The present paper deals with the role of liquid jet impingement (heat flux removal rate 200-600 W/cm2) for cooling of electronic components. The type of working fluids (Water / Fluorocarbon liquids / Dielectric fluids / Nanofluids) used for cooling, mode of heat transfer (Natural / Forced / Mixed) from electronic components, and the method of analysis (Experimental / Numerical / Combination of both) greatly influence the cooling mechanism. The electronic components considered in the present study are limited to microelectronic chips, VLSI circuit chips, integrated circuits (IC) chips and resistors. Most of the literature is pertinent to cooling of square heat sources, and many of the researchers have also focused on the comparative studies using different working fluids. Results suggest that Fluorocarbon liquids can be used for higher heat flux removal due to their high boiling point. The temperature drop obtained from the electronic components using liquid jet impingement was found to be in the range of 80-85ºC. © 2018, Global Digital Central. All rights reserved.

Journal	International Journal of Ambient Energy
Publisher	Informa UK Limited
ISSN	0143-0750
Open Access	0