The paper aims to investigate numerically the mixed convection heat transfer characteristics from seven non-identical IC chips (Aluminium) mounted on a Switch Mode Power Supply (SMPS) board (substrate) made by FR-4 (glass-reinforced epoxy laminate material). The objective is to determine the optimum configuration of these IC chips positioned at different locations on the substrate board. The optimum configuration is proposed by defining a non-dimensional geometric distance parameter (λ) and by employing a hybrid strategy (collaborating Artificial neural network (ANN) and Genetic algorithm (GA)). 3D, steady state numerical simulations are carried out using ANSYS Icepak to determine the temperature distribution of the IC chips. It has been confirmed that, the temperature of the IC chips strongly rely on their shape, size, and location on the substrate board. The hybrid optimization is the most robust technique to predict the arrangement of the IC chips on the substrate board more accurately, as compared to conventional methods. © 2018 Elsevier Ltd

Tapano Kumar Hotta

School of Mechanical Engineering

Vellore Campus

Mathew V.K

Vellore Institute of Technology (VIT) is a private university located in&nbsp;Tamil Nadu, India. Founded in 1984, as Vellore Engineering College, the institution offers 20 undergraduate, 34 postgraduate, four integrated and four research programs. It has campuses in Vellore, Amravati, Bhopal and Chennai.

VIT is one of the top ranked private universities in India according to NIRF, THE and QS Rankings.&nbsp;Govt. of India has recognized&nbsp;VIT, Vellore as an&nbsp;Institution of Eminence. This has allowed VIT to take independent quality initiatives and move up in world ranking.

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VIT University

Thermal Science and Engineering Progress

The paper aims at the transient numerical modelling under mixed convection for the cooling of seven protruding asymmetric IC chips mounted on an SMPS board using the phase change material (n-eicosane). The phase change material (PCM) is kept inside the mini-channels fabricated on the board. The objective is to bring down the temperature (minimize the maximum temperature) of the configuration (SMPS board with 7 IC chips) using the n-eicosane inside the mini-channels. It is seen that n-eicosane absorbs the heat dissipated by the IC chips and thus the maximum temperature of the configuration reduces by 5.5%. The effect of channel hydraulic diameter (2.5 mm ≤ Dh ≤ 3.5 mm) on the temperature of the IC chips is also studied. The results suggest that the mini-channel with lower hydraulic diameter gives a better rate of heat transfer from the IC chips and thus cools these effectively. The study is extended using four different phase change materials out of which, n-eicosane has resulted in maximum temperature drop from the IC chips among different PCMs due to its lower melting point value. A correlation is proposed for the non-dimensional temperature (θ) of the IC chips in terms of Fourier number (Fo) to predict the IC chip temperatures during the melting of PCM. © 2019 Elsevier Ltd

Journal of Energy Storage

Role of PCM based mini-channels for the cooling of multiple protruding IC chips on the SMPS board - A numerical study

Applied Thermal Engineering

Optimized distribution of a large number of power electronics components cooled by conjugate turbulent natural convection

Energies

Experimental Optimization of Passive Cooling of a Heat Source Array Flush-Mounted on a Vertical Plate

Electronics Cooling

Introductory Chapter: Electronics Cooling — An Overview

Proceeding of First Thermal and Fluids Engineering Summer Conference

A NUMERICAL AND EXPERIMENTAL STUDY OF OPTIMAL DISTRIBUTION OF DISCRETE HEAT SOURCE ARRAY COOLED BY NATURAL AND FORCED CONVECTION

This article reports the results of mixed convection heat transfer studies from five heat sources (aluminum) mounted at different positions on a substrate board (Bakelite). The goal is to determine the optimal arrangement, such that, the maximum temperature excess is minimum among all the possible configurations. For accomplishing this, a completely experimental driven hybrid optimization strategy, that combines Artificial neural network (ANN) with Genetic algorithm (GA) is used. Initial optimization studies are carried out by employing a heuristic non-dimensional geometric parameter λ, which is identified to be the key parameter to decide the maximum temperature in the system. © 2014 Taylor & Francis Group, LLC.

Experimental Heat Transfer

Experiment driven ANN-GA based technique for optimal distribution of discrete heat sources under mixed convection

Numerical investigation on optimal arrangement of IC chips mounted on a SMPS board cooled under mixed convection

Journal	Data powered by TypesetThermal Science and Engineering Progress
Publisher	Data powered by TypesetElsevier BV
ISSN	2451-9049
Open Access	0