Kuruvilla N

Raina J.P.

Vellore Institute of Technology (VIT) is a private university located in&nbsp;Tamil Nadu, India. Founded in 1984, as Vellore Engineering College, the institution offers 20 undergraduate, 34 postgraduate, four integrated and four research programs. It has campuses in Vellore, Amravati, Bhopal and Chennai.

VIT is one of the top ranked private universities in India according to NIRF, THE and QS Rankings.&nbsp;Govt. of India has recognized&nbsp;VIT, Vellore as an&nbsp;Institution of Eminence. This has allowed VIT to take independent quality initiatives and move up in world ranking.

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VIT University

2008 International Conference on Microelectronics

This work has investigated the performance of Single-walled carbon nanotube bundle as futuristic interconnect material under process constraints and compared its suitability as IC interconnect material as per ITRS predictions. It also analyzes variance of each parasitic effect along with the variations in process parameters. This paper pinpoints the variables causing bottlenecks in realizing optimum performance and improving reliability. It also evaluates the effect of diameter variations of CNTs in an SWCNT bundle and metallic tube ratio on the performance and reliability for 22nm technological node. The results demonstrate that the relative variations in the resistance are critically effected by the variations in metallic tube ratios rather than diameter variations. The diameter variation introduces its critical effect only at global level.

Advanced Materials Research

Performance and Reliability Analysis of Bundled SWCNT as IC Interconnects

Statistical latency analysis of carbon nanotube interconnects due to contact resistance variations

IOSR journal of VLSI and Signal Processing

Low-k Dielectric- A Potential Solution for Crosstalk Induced Signal Integrity issues in SWCNT Interconnects

2009 International SoC Design Conference (ISOCC)

A power-constrained MPU roadmap for the International Technology Roadmap for Semiconductors (ITRS)

IEEE Transactions on Electron Devices

On the Impact of Process Variations for Carbon Nanotube Bundles for VLSI Interconnect

Proceedings of the 2007 international symposium on Physical design - ISPD '07

Carbon nanotube interconnects

Journal	Data powered by Typeset2008 International Conference on Microelectronics
Publisher	Data powered by TypesetIEEE
Open Access	0