We have endeavored to develop a formaldehyde-free electroless copper deposition process. A suitable bath has been optimized with glyoxylic acid as a reducing agent. The bath parameters, such as temperature and the concentration of reducing and complexing agents, were studied. The influence of glyoxylic acid on the deposition of copper was studied by galvanostatic polarization measurements. SEM studies were also carried out to ascertain the structure of the copper deposits.