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Studies on the influence of accelerators in electroless plating process
Published in
Volume: 5
Issue: 1
Pages: 246 - 254
It is found on many occasions that the rate of electroless nickel plating (EN) with hypophosphite as the reducing agent is below 20 u/hr and so for a viable industrial process high speed electroless nickel plating is a subject of practical interest. Sulphur containing organic compounds are widely used as accelerators. Among them thiourea and its derivatives play a significant role and many of the compounds of this class still remain unexplored. Hence in the present investigation, focus is made on the role of accelerators, mainly thiourea and its derivatives in EN process. Also an attempt has been made to make use of concepts of mixed potential theory in electroless plating process. The results are presented and discussed.
About the journal
JournalInternational Journal of ChemTech Research
Authors (3)