We have investigated the kinetics of grain growth, during thermal annealing, in polycrystalline silicon heavily doped with phosporus and arsenic. We have used a thermodynamic approach to evaluate the driving force behind grain growth. An expression for grain size has been derived as a function of time and temperature of annealing and concentration of dopants, and a numerical analysis has been carried out using a computer simulation technique. The results are presented and discussed in detail. © 1988.