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Reduction of crosstalk in mixed CNT bundle interconnects for high frequency 3D ICs and SoCs
Published in IEEE
Pages: 1 - 3

This paper investigates the multi equivalent single conductor (MESC) model for mixed CNT bundles (MCBs) which contains metallic single and double walled CNTs at the core and semiconducting single walled CNTs at the periphery. This structure shows the least delay due to crosstalk.

About the journal
JournalData powered by Typeset2014 International Conference on Advances in Electrical Engineering (ICAEE)
PublisherData powered by TypesetIEEE
Open AccessNo