The performance of coupled VLSI interconnects depends on their coupling capacitance and the dielectric medium surrounding them. However, the idea of designing the geometry of CNT bundles to optimize the coupling capacitance is not considered till now. So, in this paper, we model triangular CNT (T-CNT) bundles as VLSI interconnects, for the first time. Factors that reveal the performance of interconnects like propagation delay, crosstalk delay and power dissipated by the interconnects, are simulated in this paper. We do the performance analysis of T-CNT bundle interconnects and conventionally modeled square type CNT bundle interconnects. Upon comparison of the above said metrics, it was found that T-CNT bundle interconnects performed better.
|Journal||Data powered by Typeset2016 3rd International Conference on Emerging Electronics (ICEE)|
|Publisher||Data powered by TypesetIEEE|