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Formulation of novel electroless plating process for Cu and Cu-P alloys
, , M. Hitharth, K. Sumanjeet,
Published in
Volume: 5
Issue: 1
Pages: 237 - 245
A new electroless plating formulation has been optimized based on copper sulphate, formaldehyde and sodium hypophosphite with addition of EDTA+TEA.The new bath was found stable and operated upto 2 hours. It was found that the incorporation of phosphorus in copper matrix increased the corrosion resistance of the coatings both in as plated and annealed condition. The characterization of copper and copper-Phosphorus coatings were carried out by weight gain, Vicker's hardness, potentiodynamic polarization and impedance analysis. The surface morphology of the coatings were analyzed by XRD and SEM.
About the journal
JournalInternational Journal of ChemTech Research
Authors (3)